CEMWorks presents new research at ECTC 2026 on the characterization and simulation of D-band on-chip antenna arrays.
The paper, titled “BEM-Based Characterization of a D-Band On-Chip Patch Antenna Array,” is authored by researchers from CEMWorks Inc. and Chalmers University. The work combines contactless over-the-air antenna measurement with a boundary element method simulation workflow to address an important challenge in high-frequency electronic design: how to accurately characterize antennas that are integrated directly on chip.
As wireless and sensing systems move toward sub-THz frequencies, antennas are increasingly integrated with chips, packages, and other electronic structures. This creates new measurement and simulation challenges. Conventional probing methods can disturb the antenna field, while rerouting the antenna signal to an external connector can introduce uncertainty. At the same time, full-wave simulation becomes more difficult as structures become smaller, denser, and more sensitive to material and geometry variations.
The research presented in this paper explores a combined measurement and simulation approach. The contactless over-the-air method extracts antenna impedance and realized gain without disturbing probes or rerouted feed lines. The boundary element method simulation workflow models surface currents on conductors and dielectric interfaces without requiring volumetric meshing, reducing computational complexity while preserving accuracy.
The paper cross-validates these approaches by comparing over-the-air measurements, reference simulations, and BEM results for a D-band on-chip patch antenna. The results show strong agreement between measurement and simulation, supporting the use of BEM-based simulation for on-chip antenna modeling at sub-THz frequencies.
A key part of the work is scalability. After validating the single antenna model, the study extends the simulation approach to larger array configurations. Because the BEM formulation discretizes material interfaces rather than enclosed volume, it enables practical simulation of complete D-band antenna arrays without relying on common approximations such as array factors or periodic boundary conditions.
For CEMWorks, this research reflects our continued focus on advanced electromagnetic simulation for next-generation electronic systems. As antennas, chips, interposers, and packages become more tightly integrated, accurate and scalable EM simulation will be essential for reducing design risk and enabling future high-frequency technologies.
CEMWorks is pleased to contribute this work to ECTC 2026 and to continue advancing simulation methods for on-chip and in-package antenna design.