CEMWorks recently participated in SCEE 2026, held in Lisbon, Portugal, where Dr. Jonatan Aronsson presented research developed in collaboration with NXP Semiconductors.
The presentation, titled “Efficient Method of Moments Analysis of High-Speed Interconnects,” focused on one of the growing challenges in advanced electronic design: how to efficiently analyze the signal paths that connect chips, packages, and printed circuit boards as systems become faster, denser, and more complex.
High-speed interconnects are no longer simple wires. At higher frequencies, their geometry and materials directly affect signal loss, coupling, and reflections. As advanced packaging, dense printed circuit boards, and multi-layer substrates continue to evolve, these effects move directly into the operating band, making simplified circuit models less reliable.
This is where efficient electromagnetic analysis becomes critical.
The research presented at SCEE evaluated a surface-integral Method of Moments approach for dense high-speed transmission-line structures. The benchmark compared the proposed solver against established FEM and MoM tools, checking both accuracy and efficiency through S-parameter results, runtime, matrix size, and memory usage.
The results showed that the proposed approach produced results comparable to established simulation tools while significantly reducing memory requirements. This supports the value of integral-equation methods as an efficient foundation for large-scale interconnect EM analysis.
For CEMWorks, this work reflects our continued focus on helping semiconductor and electronics teams address increasingly complex EM design challenges. As chips, packages, interconnects, and antennas become more tightly integrated, efficient full-wave simulation will play an essential role in reducing design risk and enabling next-generation electronic systems.
CEMWorks is pleased to contribute to this work alongside NXP Semiconductors and to continue advancing simulation methods for high-speed, high-density electronic design.