CEMWorks is proud to sponsor the IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium 2023, a leading international conference in the Asia-Pacific region focused on advances in chip, package, and system-level electrical design, modeling, simulation, and measurement.
Held from December 12–14, 2023 at the Sugar Beach Resort in Mauritius, EDAPS 2023 brought together researchers and industry professionals to exchange ideas on emerging challenges in semiconductor packaging and electronic system design. The symposium featured technical paper sessions, industry exhibitions, workshops, and tutorials, providing a collaborative forum for both academic and industrial communities.
As a sponsor of EDAPS 2023, CEMWorks reaffirmed its commitment to supporting the global engineering and research ecosystem. The company’s electromagnetic (EM) simulation solutions align closely with the conference’s focus on advanced packaging, system integration, and next-generation electronic design. Through engagement with researchers and practitioners at EDAPS, CEMWorks continues to support the development of accurate and scalable simulation approaches for complex electronic systems.
CEMWorks looks forward to continuing its support of international conferences such as EDAPS that promote knowledge exchange and collaboration across the semiconductor and electronics community.